HJP200 CMP

HJP200 Chemical mechanical polishing machine

It is mainly used for all flattening process equipment in wafer chip manufacturing, such as IMD, STI, ILD, BPSG, contactor, metal line, etc., while supporting TSV, MEMS and other new fields of flattening process.

Features

• The compact structure of the whole machine saves the use of purification plant space;
• Can realize "dry in and dry out" of wafers;
• Online endpoint detection mode, real-time process control;
• The control software is completely autonomous and controllable.

Skylens

SKYLENS Chemical Mechanical Polishing Equipment

 Meet all complex planarization process requirements in IC manufacturing. Suitable for mainstream 14nm/28nm logic processes, covering STI/ILD/IMD, FinFET/Metal gate/W/Cu and other processes.

Features

• Layout dimensions (length * width * height) 5.70m * 2.80m * 2.70m
• 2×2Polishing table and dual cleaning station
• Dual independent processes and transmission systems
• The grinding head and grinding table correspond in opposition, ensuring better process consistency( WIW & WTW <3%)
• The output rate has significantly increased compared to international imported equipment WPH >60

Horizon-T

6/8-inch CMP device - Horizon-T

主要用于晶圆芯片制造中所有平坦化工艺需求的设备，如IMD、STI、ILD、BPSG、contactor、metal line等，同时支持TSV、MEMS等新领域的平坦化工艺。

Features

• Compatible with 6/8-inch wafers, fully automatic dry in and dry out, flexible process switching, and wide applicability
• Support the flattening process requirements of SiC, GaN third-generation semiconductors and special materials
• Realize mass sales in China