SKYLENS Chemical Mechanical Polishing Equipment

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Product description

Meet all complex planarization process requirements in IC manufacturing. Suitable for mainstream 14nm/28nm logic processes, covering STI/ILD/IMD, FinFET/Metal gate/W/Cu and other processes.

Product Features

Layout dimensions (length * width * height) 5.70m * 2.80m * 2.70m
2×2Polishing table and dual cleaning station
Dual independent processes and transmission systems
The grinding head and grinding table correspond in opposition, ensuring better process consistency( WIW & WTW <3%)
The output rate has significantly increased compared to international imported equipment WPH >60

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