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    6/8-inch CMP device - Horizon-T

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    Product description
    • Compatible with 6/8-inch wafers, fully automatic dry in and dry out, flexible process switching, and wide applicability
    • Support the flattening process requirements of SiC, GaN third-generation semiconductors and special materials
    • Realize mass sales in China
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    ADD: Floors 1-6, Building 13, Courtyard 1, Kegu Fourth Street, Beijing Economic and Technological Development Zone, Beijing

    TEL: +86 010-59113853

    Marketing Department TEL: +86 010-59113888

    Report hotline: +86 010-59113853

    E-Mail：markering@gegvs.cn

                  haoyu.wang@gegvs.cn

     

     

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