新闻中心
News center
Check category

Precise control of polishing disc temperature of CMP polishing machine

  • Categories:Company news
  • Author:
  • Origin:
  • Time of issue:2019-12-12 17:22
  • Views:

(Summary description)The CMP process is a process of planarizing the wafer surface. Heat is generated during the removal of the wafer surface material, which causes the temperature to rise.

Precise control of polishing disc temperature of CMP polishing machine

(Summary description)The CMP process is a process of planarizing the wafer surface. Heat is generated during the removal of the wafer surface material, which causes the temperature to rise.

  • Categories:Company news
  • Author:
  • Origin:
  • Time of issue:2019-12-12 17:22
  • Views:
Information

The CMP process is a process of planarizing the wafer surface. Heat is generated during the removal of the wafer surface material, which causes the temperature to rise. In order to obtain a uniform polishing removal rate and achieve global planarization, it is necessary to The temperature is precisely controlled. The heat generation during the CMP process is analyzed and analyzed. A method to control the temperature is introduced.

Scan the QR code to read on your phone

Product technologies

Contact us

ADD: Floors 1-6, Building 13, Courtyard 1, Kegu Fourth Street, Beijing Economic and Technological Development Zone, Beijing

TEL: +86 010-59113853

Marketing Department TEL: +86 010-59113888

Report hotline: +86 010-59113853

E-Mail:markering@gegvs.cn

              haoyu.wang@gegvs.cn

 

 

SEMICORE

WeChat

Copyright © 2019   SEMICORE  All Rights Reserved.   Powered by:www.300.cn   京ICP备19058997号