Precise control of polishing disc temperature of CMP polishing machine
- Categories:Company news
- Author:
- Origin:
- Time of issue:2019-12-12 17:22
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(Summary description)The CMP process is a process of planarizing the wafer surface. Heat is generated during the removal of the wafer surface material, which causes the temperature to rise.
Precise control of polishing disc temperature of CMP polishing machine
(Summary description)The CMP process is a process of planarizing the wafer surface. Heat is generated during the removal of the wafer surface material, which causes the temperature to rise.
- Categories:Company news
- Author:
- Origin:
- Time of issue:2019-12-12 17:22
- Views:
The CMP process is a process of planarizing the wafer surface. Heat is generated during the removal of the wafer surface material, which causes the temperature to rise. In order to obtain a uniform polishing removal rate and achieve global planarization, it is necessary to The temperature is precisely controlled. The heat generation during the CMP process is analyzed and analyzed. A method to control the temperature is introduced.
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