CMP-Chemical Mechanical Polishing Technology It uses the "soft-hard" principle of wear, that is, polishing with softer materials to achieve high-quality surface polishing. In the presence of a certain pressure and polishing slurry, the workpiece being polished is relatively moved relative to the polishing pad. With the organic combination of the abrasive effect of the nanoparticles and the corrosion of the oxidant, a smooth surface 151 is formed on the surface of the workpiece being polished. The most widely used CMP technology is the polishing of silicon wafers, which are substrate materials, in integrated circuits (IC) and ultra-large-scale integrated circuits (ULSI).