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Horizon Chemical Mechanical Polishing Machine
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Number of views:
1000
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Brand equipment
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1
Product description
Mainly used for all flattening process requirements in wafer chip manufacturing equipment, such as IMD, STI, ILD, BPSG, contact, metal line, etc., while supporting flattening processes in new fields such as TSV and MEMS.
Product Features
- The entire machine has a compact structure, saving space for the purification plant;
- Can achieve "dry in and dry out" of wafers；
- Online endpoint detection method, real-time process control；
- The control software is completely autonomous and controllable.
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TEL: +86 010-59113853
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